Fraunhofer-Publica

: 55

20183D arranged reduced graphene oxide - polyethylene glycol - amine based biosensor platform for super-sensitive detection of procalcitonin
Grabbert, Niels; Fiedler, Markus; Meyer, Vera; Georgi, Leopold; Hoeppner, Katrin; Ferch, Marc; Marquardt, Krystan; Jung, Erik; Mackowiak, Piotr; Ngo, Ha-Duong; Lang, Klaus-Dieter
Abstract
20183D wire - a novel approach for 3D chips interconnection for harsh environment applications
Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2018A 60 GHz circularly polarized antenna array for line-of-sight train-to-train communication
Al-Bassam, A.; Alshrafi, W.; Heberling, D.
Conference Paper
2018Adaptives Low-Power Sensor- und Funknetzwerk für Assistenzsysteme im Bereich altersgerechtes Wohnen (ALFA)
Al-Batol, Muaadh; Bickel, Jan; Ngo, Ha Duong
Book Article
2018Broadband GaN-based power amplifier MMIC and module for V-band measurement applications
Schwantuschke, Dirk; Brueckner, Peter; Amirpour, Raul; Tessmann, Axel; Kuri, Michael; Rießle, Markus; Massler, Hermann; Quay, Rüdiger
Conference Paper
2018Buried-heterostructure quantum cascade lasers fabricated using a sacrificial layer and a two-step regrowth process
Driad, Rachid; Bächle, Andreas; Aidam, Rolf; Yang, Quankui K.
Conference Paper
2018Decoration of Al implantation profiles in 4H-SiC by bevel grinding and dry oxidation
Kocher, Matthias; Erlbacher, Tobias; Kocher, Matthias; Bauer, Anton
Poster
2018Defects and carrier lifetime in 4H-Silicon Carbide
Kallinger, Birgit; Erlekampf, Jürgen; Rommel, Mathias; Berwian, Patrick; Friedrich, J.; Matthus, Christian D.
Presentation
2018Determination of compensation ratios of Al-implanted 4H-SiC by TCAD modelling of TLM measurements
Kocher, Matthias; Yao, Boteng; Weisse, Julietta; Rommel, Mathias; Xu, Zongwei; Erlbacher, Tobias; Bauer, Anton
Poster
2018Development of a high resolution magnetic field position sensor system based on a through silicon via first integration concept
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Conference Paper
2018Digital control for off-line power supplies using digital platform DP2
Radecker, Matthias; Trentin, Vinicius; Le, Li
Presentation
2018Dose dependent profile deviation of implanted aluminum in 4H-SiC during high temperature annealing
Kocher, Matthias; Rommel, Mathias; Sledziewski, Tomasz; Häublein, Volker; Bauer, Anton
Poster
2018Drahtlose Synchronisation eines Sensornetzwerks mit Hilfe opportunistischer Signale.
Tröger, Hans-Martin
Book
2018Dynamic load modulated low-voltage GaN PA using novel low-loss GaN varactors
Amirpour, Raul; Krause, Sebastian; Quay, Rüdiger; Ambacher, Oliver
Conference Paper
2018The effect of etching and deposition processes on the width of spacers created during self-aligned double patterning
Baer, Eberhard; Lorenz, Juergen
Conference Paper
2018The effects of thermal and correlated noise on magnons in a quantum ferromagnet
Jeske, Jan; Rivas, Ángel; Ahmed, Muhammad H.; Martin-Delgado, M.A.; Cole, Jared H.
Journal Article
2018Enhanced behavioral models of MEMS elements for system level verification
Blochmann, Tino; Gerth, Stephan; Schneider, Peter; Jancke, Roland
Conference Paper
2018Erweiterung des Dynamikbereichs von direktabtastenden Hochfrequenz-Empfängern
Ulbricht, Gerald
: Gerhäuser, Heinz
Dissertation
2018ESD robustness of IoT devices: Are we going to face new challenges?
Wolf, Heinrich
Presentation
2018Fabrication and characterization of bending-independent capacitive CMOS pressure sensor stacks
Fischer, Roland; Ditler, Heinrich; Görtz, Michael; Mokwa, Wilfried
Journal Article, Conference Paper
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
Conference Paper
2018Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O.
Conference Paper
2018Funktional mock-up interface paving the way for digital twins
Schneider, Peter
Presentation
2018A G-band broadband balanced power amplifier module based on cascode mHEMTs
Amado-Rey, Belén; Campos-Roca, Yolanda; Friesicke, Christian; Raay, Friedbert van; Massler, Hermann; Leuther, Arnulf; Ambacher, Oliver
Journal Article
2018High-power asymmetrical three-way GaN doherty power amplifier at C-band frequencies
Derguti, Edon; Ture, Erdin; Krause, Sebastian; Schwantuschke, Dirk; Quay, Rüdiger; Ambacher, Oliver
Conference Paper
2018An HMM-based averaging approach for creating mean motion data from a full-body Motion Capture system to support the development of a biomechanical model
Kitzig, Andreas; Demmer, Julia; Bolten, Tobias; Naroska, Edwin; Stockmanns, Gudrun; Viga, Reinhard; Grabmaier, Anton
Journal Article, Conference Paper
2018Influence of substrate properties on the defectivity and minority carrier lifetime in 4H-SiC homoepitaxial layers
Kallinger, Birgit; Erlekampf, Jürgen; Roßhirt, Katharina; Berwian, Patrick; Stockmeier, Matthias; Vogel, Michael; Hens, Philip; Wischmeyer, Frank
Presentation
2018Laser repair of defects in GaN LEDs
Delmdahl, Ralph; Passow, Thorsten; Kunzer, Michael; Binder, Michael
Journal Article
2018Low power, low noise JFETs for room temperature X-ray detectors
Sturm, Leonhard; Nebrich, L.; Neumeier, K.; Eisele, I.; Kutter, C.
Conference Paper
2018Low profile open MEMS and ASIC packages manufactured by flexible hybrid integration in a roll-to-roll compatible process
Bose, Indranil; Palavesam, Nagarajan; Hochreiter, Christian; Landesberger, Christof; Kutter, Christoph
Conference Paper
2018mm-Wave operation of AlN/GaN-devices and MMICs at V- & W-band
Schwantuschke, Dirk; Godejohann, Birte-Julia; Brueckner, Peter; Tessmann, Axel; Quay, Rüdiger
Conference Paper
2018Normalized differential conductance to study current conduction mechanisms in MOS structures
Nouibat, T.H.; Messai, Z.; Chikouch, D.; Ouennoughi, Z.; Rouag, N.; Rommel, Mathias; Frey, Lothar
Journal Article
2018One-step nanoimprinted Bragg grating sensor based on hybrid polymers
Förthner, Michael; Girschikofsky, Maiko; Rumler, Maximilian; Stumpf, Florian; Rommel, Mathias; Hellmann, Ralf; Frey, Lothar
Journal Article
2018Phase measurement for driven spin oscillations in a storage ring
Hempelmann, N.; Hejny, V.; Pretz, J.; Soltner, H.; Augustyniak, W.; Bagdasarian, Z.; Bai, M.; Barion, L.; Berz, M.; Chekmenev, S.; Ciullo, G.; Dymov, S.; Eversmann, D.; Gaisser, M.; Gebel, R.; Grigoryev, K.; Grzonka, D.; Guidoboni, G.; Heberling, D.; Hetzel, J.; Hinder, F.; Kacharava, A.; Kamerdzhiev, V.; Keshelashvili, I.; Koop, I.; Kulikov, A.; Lehrach, A.; Lenisa, P.; Lomidze, N.; Maanen, P.; Macharashvili, G.; Magiera, A.; Mchedlishvili, D.; Mey, S.; Müller, F.; Nass, A.; Nikolaev, N.N.; Nioradze, M.; Pesce, A.; Prasuhn, D.; Rathmann, F.; Rosenthal, M.; Saleev, A.; Schmidt, V.; Semertzidis, Y.; Senichev, Y.; Shmakova, V.; Silenko, A.; Slim, J.; Stahl, A.; Stassen, R.; Stephenson, E.; Stockhorst, H.; Ströher, H.; Tabidze, M.; Tagliente, G.; Talman, R.; Thörngren Engblom, P.; Trinkel, F.; Uzikov, Y.; Valdau, Y.; Valetov, E.; Vassiliev, A.; Weidemann, C.; Wrońska, A.; Wüstner, P.; Zuprański, P.; Żurek, M.
Journal Article
2018Photonic crystal THz High-Q resonator for chipless wireless identification
Jiménez-Sáez, Alejandro; Schüßler, Martin; Krause, Christopher; Meyer, Frederic; Bögel, Gerd vom; Jakoby, Rolf
Conference Paper
2018Piezoresistive pressure sensors for applications in harsh environments - a roadmap
Ngo, Ha Duong; Ehrmann, Oswin; Schneider-Ramleow, Martin; Lang, Klaus-Dieter
Book Article
2018Prediction of SRAM reliability under mechanical stress induced by harsh environments
Warmuth, Jens; Giering, Kay-Uwe; Lange, André; Clausner, André; Schlipf, Simon; Kurz, Gottfried; Otto, Michael; Paul, Jens; Jancke, Roland; Aal, Andreas; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system
Adamietz, Raphael; Desmulliez, Marc P.Y.; Pavuluri, Sumanth Kumar; Tilford, Tim; Bailey, Chris; Schreier-Alt, Thomas; Warmuth, Jens
Journal Article
2018RF-noise modeling of InGaAs metamorphic HEMTs and MOSFETs
Heinz, Felix; Schwantuschke, Dirk; Leuther, Arnulf; Tessmann, Axel; Ohlrogge, Matthias; Quay, Rüdiger; Ambacher, Oliver
Conference Paper
2018Silicon micro piezoresistive pressure sensors
Ngo, Ha Duong; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter
Book Article
2018Spurious mode suppression in the design of GCPW submillimeter-wave power amplifiers
Amado-Rey, Belén; Tessmann, Axel; Campos-Roca, Yolanda; Massler, Hermann; Leuther, Arnulf; Ambacher, Oliver
Conference Paper
2018State dependency, low-frequency dispersion, and thermal effects in microwave III-V HEMTs
Raay, Friedbert van; Schwantuschke, Dirk; Leuther, Arnulf; Brueckner, Peter; Peschel, Detlef; Quay, Rüdiger; Schlechtweg, Michael; Ambacher, Oliver
Conference Paper
2018Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.
Conference Paper
2018Template-driven analog layout generators for improved technology independence
Prautsch, Benjamin; Hatnik, Uwe; Eichler, Uwe; Lienig, Jens
Conference Paper
2018Ultra-broadband frequency multiplier MMICs for communication and radar applications
Grötsch, Christopher; Wagner, Sandrine; Leuther, Arnulf; Meier, Dominik; Kallfass, Ingmar
Conference Paper
2018Ultra-low-power SAR ADC in 22 nm FD-SOI technology using body-biasing
Jotschke, Marcel; Rao, Sunil Satish; Prautsch, Benjamin; Reich, Torsten
Conference Paper
2018Ultra-thin 50 um fan-out wafer level package: Development of an innovative assembly and de-bonding concept
Woehrmann, Markus; Braun, T.; Toepper, M.; Lang, K.-D.
Conference Paper
2018Untersuchung der elektrischen Feldstärke und des Teilentladungsverhaltens an keramischen Schaltungsträgern
Bayer, Christoph Friedrich
: Frey, Lothar
Dissertation
2018Wafer level embedding technology for packaging of planar GaN half-bridge module in high power density conversion applications
Manier, Charles-Alix; Klein, Kirill; Wuest, Felix; Gernhardt, Robert; Oppermann, Hermann; Cussac, Philippe; Andzouana, Sophie; Mitova, Radoslava; Lang, Klaus-Dieter
Conference Paper
2017Analysis of absorption mechanism in a planar radome absorber
Hamid, S.; Heberling, D.
Conference Paper
2017Laser direct patterning of polymer resins for structured adhesive wafer to wafer bonding
Zoschke, Kai; Lang, K.-D.
Conference Paper
2017The roadmap of development of piezoresistive micro mechanical sensors for harsh environment applications
Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter
Conference Paper
2017Silizium Einbett-Technologie mittels Wafer Level Packaging für GaN Leistungselektronik-Bauteilen
Manier, Charles-Alix; Gernhardt, R.; Zoschke, K.; Moens, P.; Oppermann, H.; Lang, K.-D.
Conference Paper
2017Verbindungstechnologien zur Herstellung hochpixelierter LED-Lichtquellen
Brink, Morten; Oppermann, H.; Lang, K.-D.
Conference Paper
2017What's hot what's not: The social construction of product obsolescence and its relevance for strategies to increase functionality
Jaeger-Erben, Melanie; Proske, Marina
Conference Paper